It is said that AMD next generation graphic core possible be named RV870 and according to TSMC technology, it will use 40nm or 45nm technology. The core area of RV870 will be about 140m㎡ which is much smaller than RV770 260m㎡. As we know by now, it will have 192 ALU. RV770 each ALU matched 5SP and then RV870 will have 960SP. In order to control the core area, it is still 256bit. We believe RV870 will be 1.2 times than RV770 in performances, but this will be decided by the clock of RV870.
It is also said that AMD next generation R800 will use new design. We know Radeon HD3870X2 and the coming Radeon HD4870X2 both used single PCB+dual graphic core design while R800 will possible use real dual core design. If so, AMD next generation flagship R800 will be the first dual core GPU. The specs of R800 will double RV870.
Advanced 45nm (40nm?) will bring RV870 smaller core area. The current RV770 did well in performances but the temperature is really terrible. If RV870 can settle this problem and further improve performances, it will be really excited for us and it will be the first real dual core GPU possibly.